APICAL® Polyimide NP

Apical® Polyimide Film Division

Type NP Polyimide Film

APICAL® Polyimide Film Is the Right Choice.

APICAL® Type NP Polyimide Film is a tough aromatic Polyimide Film especially designed for applications where superior dimensional stability is essential, such as flexible printed circuits and tape automated bonding. This superior dimensional stability is achieved by having a controlled coefficient of thermal expansion (matches that of copper over normal processing conditions).

Apical® Polyimide NP - Grade Table

Apical Polyimide Grade Nominal Thickness
50NP 0.49
100NP 0.98
200NP 1.97
300NP 2.95

Polyimide Films

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Here's your chance to ask Kaneka Engineers questions about APICAL Polyimide film and its applications. Use it as an open exchange of ideas and questions about polyimide applications, challenges, and innovations. ​
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APICAL® Polyimide NP - Grade Details

Thermal Properties and Heat Seal Strength of APICAL® Type NP Polyimide Film Types AV, AF, and NP APICAL® Polyimide Film are listed by Underwriters Laboratories, Inc. under their file number E135495. A thermal index of 240°C (464°F) for electrical properties (all types and gauges) and 200°C (392°F) to 220°C (428°F) for mechanical properties (depending upon the type and gauge) are listed. Underwriters Laboratories, Inc. lists flammability of UL94-VO for Types AV, AF, and NP APICAL® Polyimide Film.


More Information


Industries who depend upon APICAL® Polyimide Film benefit not only from a carefully designed product, but from the process behind it as well. Unlike many film manufacturers, APICAL® Polyimide process technology is driven by quality not speed.


In spite of being lighter in weight than many of the materials it has replaced, the overall performance of APICAL® Polyimide surpasses them. Its high degree of dimensional stability allows it to be wrapped tightly for applications where space is a premium. It is tough, highly resistant to tearing, abrasion and puncture.

Technical Data

APICAL® Polyimide Films possess an excellent balance of physical, thermal, electrical, and chemical properties over a wide range of temperatures for flexible printed circuits, tape automated bonding, motor generator insulation, wire and cable insulation, pressure sensitive tape and other uses.

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